The present situation and the trend of development of the miniaturization of the electromechanical integration

In 1959, Richard· P· Feynman( In 1965 the Nobel Prize for physics laureate) This paper puts forward the basic idea of the micro mechanical. In 1962 the first silicon micro pressure sensor, then developed the size of 50 ~ 500 m gear, gear pump, pneumatic turbine and micro mechanical fittings, etc. In 1965, Stanford university developed the silicon microelectrode probes, then in scanning tunneling microscopy (STM); Micro sensor is success. In 1987 at the university of California, Berkeley, developed the rotor diameter of 12 ~ 60 m silicon micro static motor, shows that using silicon micromachining technology to make small and movable structure and compatible with integrated circuit to produce tiny system's potential. Micro mechanical is an emerging, multidisciplinary cross high-tech fields, faced with many subjects, involving many key technologies. When a system when the characteristic size reach micron grade and nanoscale, will produce many new scientific questions. Micro mechanical processing technology as the most key of micro mechanical technology, will have a bigger development. Silicon processing and journalist on processing and would-be journalist on processing is becoming more complex, more depth is suitable for all kinds of requirements of material properties and the surface characteristics of microstructure and the production of different materials, especially functional materials microstructure, more easily and the direction of the integrated circuit development, a variety of processing technology as well as the important direction. In the design of the micro mechanical structure and process design is toward to the characteristics of the devices and systems analysis and evaluation of the implementation of the design of the system development direction, introducing virtual reality technology. Engraving machine price information in yifan numerical control network.