Laser cutting machine to realize high speed laser drilling to provide solutions

Available on the market at present laser source and the scanning galvanometer can achieve large drilling rate of 4000 per second. Using a new optical concept, high-performance galvanometer scanning and the combination of laser frequency divider for laser cutting machine to realize high speed laser drilling provides a potential solution. The plan calls for the average output power hundreds of watts of laser source, pulse width in a microsecond range. There are already some different system solutions to meet the different needs of users.
in the production of high efficiency solar cells, high speed laser drilling is an important processing step, especially in the need to more than 10000 drill hole on each unit of the winding emitter perforation ( EWT) In the production of solar cells. For solar cell production line of typical duration for a single processing step 1 - Per second for 2 seconds, 10000 hole drilling speed is low industrialized mass production requirements. The principle of laser drilling is a high energy laser beam irradiation on the processing objects, object part temperature rise by illuminate, when the temperature reaches melting point began to melt, absorbs the latent heat of fusion at the same time; To melt object continue to heat under laser irradiation, temperature rise further, when liquid vaporization temperature reached between began to vaporize, absorbs the latent heat of vaporization at the same time, evaporation constant volatilization, constantly leaving deep hole on the object, complete the drilling process. Research shows that the pulse width and pulse energy is the key factor for efficient drilling. By using two sets of Jenoptik Jenlas IR laser, 70 is expected to 200 microns thick on the wafer/s 9600 hole drilling speed, on the wafer of 180 microns thick/s 12500 hole drilling speed.