Enclosed Type

Laser cutting encapsulation removal applications

by：Transon 2020-10-31

Laser cutting machine application in the encapsulation removal material removal technology used to remove packaging materials of laser cutting system is mainly composed of laser, laser scanning system, 3 d mobile platform, image monitoring system, computer control system. Because the sample packaging material sort is more, Such as asphalt, epoxy resin, ceramic, metal and other materials) , geometric shape each are not identical, to achieve stripping the packaging material of the sample without damage, according to the analysis of experimental results, choose appropriate wavelength of laser and laser works and determine the appropriate power, realize the safety of the processed material removal, sweep method is adopted in computer control to deal with samples, this method is high precision, which can realize non-contact cutting, easy to realize automation. Remove the packaging materials mainly for packaging materials: ( 1) The chip of surface coating materials from; （ 2) Take class protection device on PCB or module resin content to remove; （ 3) Metal or ceramic chip packaging, for each device packaging material not injury after removing devices themselves.

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