Laser technology meet the high precision of high precision high standards

Since the beginning of the laser technology, has received the widespread attention, and gradually expand its application field. Laser machining technology belongs to the non-contact way, so do not produce mechanical extrusion or mechanical stress, the laser focused beam very fine, fine processing on the small size of the components, especially in electronics, semiconductor processing requirements. Also, because of laser processing technology of high efficiency, no pollution, high precision, small heat affected zone, so in electronic circuits, semiconductor, precision components widely used in the manufacturing industry.
工业激光性应用市场直接使用电子设备,微电子,电子工业,光通过程工业和光机电一体化系统设备市场发展的影响。 激光加工系统是满脚上述新兴产业装备所必备性和先进制造技术。 And carbon dioxide laser, semiconductor laser, solid laser, semiconductor pump solid state laser and excimer laser, optical 釬 laser and its processing equipment demand is big, fast development of industrial laser processing system. Combined with laser marking used in precision machining, cutting, welding, surface treatment, measurement such as the introduction of laser technology, not only promoted the development of the microelectronics industry, also provides favorable conditions for the semiconductor manufacturing industry. Its processing method and typical application in the following respects: 1. 杆标准:手架按键杆标准,电子元器件杆标,键盘打标,芯单杆标,集成电路杆标,集成电路( IC) 上杆标和to - 92 bulk triode, strip triode, strip chip marking; 2. Cutting: the silicon wafer cutting 3. Welding: microelectronics components, integrated circuit lead precision parts, such as welding, high power diode, cell phone batteries, electronic components, such as welding, optical communication device of multiple beam welding, precision mould spot welding.