The dry etching is by far the most common way of etching

His with gas as the main medium of etching, driven by plasma volume and response. In the process of the semiconductor etching was used to remove some material from the wafer surface.



in semiconductor technology, etching is from silicon surface by chemical or physical methods to selectively remove unwanted material, graphic process steps required to replicate on silicon wafers. Reactive ion etching anisotropy can realize fine graphic transformation, with the development of large scale integrated circuit technology, to meet the requirements of the size of the smaller and smaller, and reactive ion etching has become a sub-micron size the main way of etching. Based on the research of the etching process, select the appropriate process parameters ( Such as rf power, air pressure, gas flow rate, etc. ) , can get the best technological conditions, and to insure the effect of etching in at the same time improve the etching rate, is the goal of the etching process.



laser equipment factory company also have this one dry etching machine HZZ - H500, its each contains a set of system imported from laser source ( 纤维或紫外线) , drivers, optical system group, X-ray Y type rectangular linear motor motion systems, Z axis focal length tuning platform, platform five phase stepper motor, CCD intelligent automatic positioning system. Superior performance, high levels of quality, become more and more customers to choose.



in the past, in the integrated circuit ( IC) Lead frame is widely used in the production of rushed into shape technology. In order to adapt to adapt to the micro assembly high integration for lead frame of high precision, more than the number of feet, are currently adopted etching for IC lead frame of legal system.



dry etching machine in the production of the application of more and more widely, the laser equipment factory has been tried, study hard, and create a leading national dry etching machine.