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The matters needing attention in the process of optical fiber laser cutting machine in cutting
by：Transon
2020-10-30
Optical fiber laser cutting machine in the process of cutting, high temperature gradient in the material induced by high internal stress.
Around move the light source, there are two distinct areas, near the light source and light source behind is a compression zone, material compressive stress;
And on a distance in front of a light source, role stress is tensile stress on the material.
Laser cutting along the cutting seam cracks are mainly caused by the tensile stress, when the large tensile stress value is greater than the allowable tensile stress of material, will produce, in the front of the kerf width along the tangential fracture.
If for linear cutting due to shear crack in front of a light beam, beam moving at a certain speed, does not exist along the tangential fracture phenomenon.
In the curve of cutting process.
The internal stress causes in the corner and tangent direction cracks along the cutting path.
Tangential crack is material thermal stress direction with the laser scanning path.
With narrow winding path, the thermal stress direction and laser scanning trajectory deviation also increases gradually, cutting more and more difficult, can't even cut.
When cutting quartz glass this kind of brittle material, tangential fracture is a kind of uncontrollable phenomenon, cause the material random fracture damage, seriously affect the material cutting processing quality.
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