In the laser cutting machine laser cleaning process

Laser cleaning is a mechanical device, the energy and dirt layer integrated the relevant factors. Laser cutting machine if most dirt to 1. 064 um light absorption strong, laser cutting machine in the cleaning process can be under the low energy ( < 1j/cm2) Easily, and reduced the damage to the underlying surface to low. Strong energy absorption leads to rapid heating and concurrent dirt particles. Due to pulse wavelength is very short, fast expansion process, force can be generated by the dirt particles ejected from the surface. This is a selective process. If energy is slightly increased, some material will be heated to a high enough temperature and evaporation. At a higher energy ( Greater than 1. 5 j/cm2, value depends on the dirt floor) , the process of removing dirt mechanism becomes more complex, and including plasma formation and generated near the surface of the vibration wave. This cleaning selectivity was reduced, and can lead to the destruction of the underlying surface. Cleaning process, therefore, should use low practical energy, it has higher selectivity of laser cutting machine operation.