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What is a lithography machine? This equipment can not be used in microfluidic above
by：Transon
2021-01-11
Lithography is the key equipment in the photolithography process in chip manufacturing, high technology content and value of the content.
Lithography need a lot of advanced technologies, such as system integration, precision optics, precision motion, precision material transmission, high precision micro environmental control and so on.
It is the most advanced technology of semiconductor manufacturing equipment of all equipment, so a single value is very high.
laser: a light source, is one of the key equipment of lithography.
beam aligner: modify the incident direction of the light beam, the laser beam as parallel as possible.
power controller: control applied to energy on silicon, eventually underexposed or underexposed will seriously affect the image quality.
beam shape Settings: beam is set to have different shapes, such as circular and annular, and different state of beam with different optical properties.
shader: without exposure to prevent the beam to the wafer.
energy detector: check whether the final incident energy of the beam meets the demand of exposure, and provide it to adjust the energy back to the controller.
mask: internal glass with circuit design, worth hundreds of thousands of dollars.
mask table: a line of sports equipment, the precision of the motion control nanoscale.
objective: the objective lens is composed of more than 20 lens, main function is to reduce the schematic mask, and then narrow to a silicon laser mapping, and various optical lens can compensate the error. Technical difficulties lies in the design of the objective lens and the requirement of high precision.
inventory and exposure meter: used for conveying of silicon wafer table typical lithography need measurement and light again, and only need a double work table ASML lithography exposure can be achieved a silicon wafer and the other a silicon wafer. Can be measured and alignment film can effectively improve the work efficiency.
internal seal framework, shock absorber, isolates the workbench and the external environment, so that it is flat and level, reduce the external vibration interference, maintain a stable temperature and pressure.
the classification of the lithography
lithographic machine according to the operation simplicity usually divided into three types: manual, semi-automatic and fully automatic.
manual: refers to the alignment adjustment method, through the X axis and Y axis and subsidence Angle change to manually adjust the knob, you can imagine the alignment precision.
B semi-automatic: by electrical axis according to the position of the CCD alignment adjustment.
C: automatically from print to upload and download, exposure time and exposure frequency controlled by program, automatic printing machine is mainly to meet the demand of the plant, yield.
laser: a light source, is one of the key equipment of lithography.
beam aligner: modify the incident direction of the light beam, the laser beam as parallel as possible.
power controller: control applied to energy on silicon, eventually underexposed or underexposed will seriously affect the image quality.
beam shape Settings: beam is set to have different shapes, such as circular and annular, and different state of beam with different optical properties.
shader: without exposure to prevent the beam to the wafer.
energy detector: check whether the final incident energy of the beam meets the demand of exposure, and provide it to adjust the energy back to the controller.
mask: internal glass with circuit design, worth hundreds of thousands of dollars.
mask table: a line of sports equipment, the precision of the motion control nanoscale.
objective: the objective lens is composed of more than 20 lens, main function is to reduce the schematic mask, and then narrow to a silicon laser mapping, and various optical lens can compensate the error. Technical difficulties lies in the design of the objective lens and the requirement of high precision.
inventory and exposure meter: used for conveying of silicon wafer table typical lithography need measurement and light again, and only need a double work table ASML lithography exposure can be achieved a silicon wafer and the other a silicon wafer. Can be measured and alignment film can effectively improve the work efficiency.
internal seal framework, shock absorber, isolates the workbench and the external environment, so that it is flat and level, reduce the external vibration interference, maintain a stable temperature and pressure.
the classification of the lithography
lithographic machine according to the operation simplicity usually divided into three types: manual, semi-automatic and fully automatic.
manual: refers to the alignment adjustment method, through the X axis and Y axis and subsidence Angle change to manually adjust the knob, you can imagine the alignment precision.
B semi-automatic: by electrical axis according to the position of the CCD alignment adjustment.
C: automatically from print to upload and download, exposure time and exposure frequency controlled by program, automatic printing machine is mainly to meet the demand of the plant, yield.
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