Jinan Transon CNC Equipment Co., Ltd.
S I N C E 2 0 1 0
What are the main points of the cutting machine of choose and buy?
by：Transon
2020-10-29
Often for steel plate processing control staff knows, the hardness of steel plate length is often high, even if will compare thin plate bending with a certain Angle also need to spend a lot of effort, people in the manipulation in the process of the need to face up to the application of tools and equipment, for traditional processing industry, plate bending length is often difficult.
when using large wafer cutting machine should also face up to the selection of mold, bending machine on plate bending manipulation in the process of the wastage of the mould is relatively serious, thought that let bending more efficient manipulation, users should pay attention to the selection of die material, so that we can make mould in use process can avoid a lot of maintenance work.
in order to use the wafer cutting machine more while Gary was quick, work staff should also face up to the selection of equipment, the first thing you need to the precision of the equipment as a focus of choose and buy, very many bending equipment at present, the precision of different equipment scale also has certain differences, some processing to the processing effect of plank is very seriously, so during the process control sheet machining precision of dimension, as the key content the use requirement, if choose equipment would affect the other process.
now our big crystal length also often more kinds of cutting machine, bending machine, so choose the appropriate type and length is often important, the choice of equipment is also produce directly decides the working efficiency, so when using the bending process should be combined with the above measure to select the right equipment. Now we have many big crystal into application and effectively improve the drawback of the cutting machine, due to the bending equipment can implement automatic processing purpose, so that it can effectively improve the disadvantages of traditional manual bend manipulation, people in the metal processing can be more convenient.
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share important function and application of laser cutting machine
when using large wafer cutting machine should also face up to the selection of mold, bending machine on plate bending manipulation in the process of the wastage of the mould is relatively serious, thought that let bending more efficient manipulation, users should pay attention to the selection of die material, so that we can make mould in use process can avoid a lot of maintenance work.
in order to use the wafer cutting machine more while Gary was quick, work staff should also face up to the selection of equipment, the first thing you need to the precision of the equipment as a focus of choose and buy, very many bending equipment at present, the precision of different equipment scale also has certain differences, some processing to the processing effect of plank is very seriously, so during the process control sheet machining precision of dimension, as the key content the use requirement, if choose equipment would affect the other process.
now our big crystal length also often more kinds of cutting machine, bending machine, so choose the appropriate type and length is often important, the choice of equipment is also produce directly decides the working efficiency, so when using the bending process should be combined with the above measure to select the right equipment. Now we have many big crystal into application and effectively improve the drawback of the cutting machine, due to the bending equipment can implement automatic processing purpose, so that it can effectively improve the disadvantages of traditional manual bend manipulation, people in the metal processing can be more convenient.
。
share important function and application of laser cutting machine
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