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Of the bistable liquid crystal film cutting half cutting technics
by：Transon
2021-01-08
The invention aims to solve the above problems, and provides a does not lead to the first conductive layer of liquid crystal film and the second conductive layer combining with liquid crystal film cutting method and cholesteric phase liquid membrane.
in order to achieve the above purpose, the present invention provides a liquid crystal film cutting method, described in LCD liquid crystal film including liquid crystal layer and layer on both sides of the first conductive layer and the second conductive layer, its characteristic is that the cutting method includes:
half cut process: using the cutting tools all along the secant of liquid crystal film cutting, the cutting depth deep into liquid crystal film part between the first conductive layer and the second conductive layer; Whole cutting process: using the cutting tool along the second cutting line of liquid crystal film cutting, the cutting depth can be along the thickness direction of the liquid crystal film cutting liquid crystal film to make the first size liquid crystal film is cut into several separate second size liquid crystal film; Among them, described in the first second dimension size is greater than the stated, described the first all secant cutting position falls into the second cutting line cutting position.
further, to half cut process, after the whole cutting process; By cutting tools all along the secant method of cutting liquid crystal film, the liquid crystal film for the first size liquid crystal film.
further, to the whole cutting process, and a half after cutting process, the use of cutting tools for liquid crystal film all along the secant cutting, the liquid crystal film for the second size liquid crystal film.
further, described half cutting process with the whole cutting process at the same time, as described in the first cutting head and cutting tool with parallel interval second cutting head, the above mentioned in cutting head of cutting depth is less than 1 second cutting head of cutting depth.
further, described in cutting tools for the laser cutter, its all along the secant line of liquid crystal film cutting when using the first cutting energy cutting, the second cut along the line of liquid crystal film cutting when using the second cutting energy cutting, described in the second cutting energy is greater than the first cutting energy.
further, described the first all vertexes and the distance between the second cutting line cutting edge graphics to 0. 1 ~ 10毫米。
further, which in turn includes the following steps:
half cutting process: the use of cutting tools all along the secant of the size liquid crystal film cutting, the cutting depth deep into liquid crystal film of the distance between the first conductive layer and the second conductive layer, so that in the first size liquid crystal film is formed on a number of third the size of the area and is located in the third dimension of LCD liquid crystal membrane membrane area periphery cutout area; Remove leftover material: will be the first on the size of the liquid crystal film cutting depth of the cutout area above the material from the first size of liquid membrane separation, the third the size of material is intervals in the area of liquid crystal film of reserves in the first size liquid crystal membrane; Whole cutting process: using the cutting tool along the second liquid crystal film of the size of cutting wire cutting, the cutting line corresponds to a third the size of the edge of the LCD membrane area, the cutting depth can be along the thickness direction of the liquid crystal film cut off the whole liquid crystal film, to make the size of the liquid crystal film is cut into several separate second size liquid crystal film, the second size liquid crystal film including third the size of the liquid crystal film area.
further, it includes the following steps in turn:
the whole cutting process: using the cutting tool along the second liquid crystal film of the size of cutting wire cutting, the cutting depth can be along the thickness direction of the liquid crystal film cutting liquid crystal film to make the first size liquid crystal film is cut into several separate second size liquid crystal film; Half cutting process: using the cutting tools all along the secant of the size liquid crystal film cutting, first of all the position of the secant from the edge of the second size liquid crystal film to within 0. 1 ~ 10 mm, deep into liquid crystal film cutting tools for cutting depth of the distance between the first conductive layer and the second conductive layer, so that in the second the size of the liquid crystal film is formed on a third the size of the area and is located in the third the size of the LCD liquid crystal membrane membrane area periphery cutout area; Remove leftover material: the second size LCD membrane cutout area above the cutting depth of materials from the second size of liquid membrane separation, the third the size of liquid crystal film material in the area of the complete reserves in the second on the size of the liquid crystal film.
further, all secant described in the first and the second cutting line spacing between cutting graphics, respectively, including several of the closing of the graphics.
using the laser cutting machine laser equipment factory HZZ - endeavour V3000( 我。 LASER3000) Perfect to help you solve the problem of bistable liquid crystal film cutting.
in order to achieve the above purpose, the present invention provides a liquid crystal film cutting method, described in LCD liquid crystal film including liquid crystal layer and layer on both sides of the first conductive layer and the second conductive layer, its characteristic is that the cutting method includes:
half cut process: using the cutting tools all along the secant of liquid crystal film cutting, the cutting depth deep into liquid crystal film part between the first conductive layer and the second conductive layer; Whole cutting process: using the cutting tool along the second cutting line of liquid crystal film cutting, the cutting depth can be along the thickness direction of the liquid crystal film cutting liquid crystal film to make the first size liquid crystal film is cut into several separate second size liquid crystal film; Among them, described in the first second dimension size is greater than the stated, described the first all secant cutting position falls into the second cutting line cutting position.
further, to half cut process, after the whole cutting process; By cutting tools all along the secant method of cutting liquid crystal film, the liquid crystal film for the first size liquid crystal film.
further, to the whole cutting process, and a half after cutting process, the use of cutting tools for liquid crystal film all along the secant cutting, the liquid crystal film for the second size liquid crystal film.
further, described half cutting process with the whole cutting process at the same time, as described in the first cutting head and cutting tool with parallel interval second cutting head, the above mentioned in cutting head of cutting depth is less than 1 second cutting head of cutting depth.
further, described in cutting tools for the laser cutter, its all along the secant line of liquid crystal film cutting when using the first cutting energy cutting, the second cut along the line of liquid crystal film cutting when using the second cutting energy cutting, described in the second cutting energy is greater than the first cutting energy.
further, described the first all vertexes and the distance between the second cutting line cutting edge graphics to 0. 1 ~ 10毫米。
further, which in turn includes the following steps:
half cutting process: the use of cutting tools all along the secant of the size liquid crystal film cutting, the cutting depth deep into liquid crystal film of the distance between the first conductive layer and the second conductive layer, so that in the first size liquid crystal film is formed on a number of third the size of the area and is located in the third dimension of LCD liquid crystal membrane membrane area periphery cutout area; Remove leftover material: will be the first on the size of the liquid crystal film cutting depth of the cutout area above the material from the first size of liquid membrane separation, the third the size of material is intervals in the area of liquid crystal film of reserves in the first size liquid crystal membrane; Whole cutting process: using the cutting tool along the second liquid crystal film of the size of cutting wire cutting, the cutting line corresponds to a third the size of the edge of the LCD membrane area, the cutting depth can be along the thickness direction of the liquid crystal film cut off the whole liquid crystal film, to make the size of the liquid crystal film is cut into several separate second size liquid crystal film, the second size liquid crystal film including third the size of the liquid crystal film area.
further, it includes the following steps in turn:
the whole cutting process: using the cutting tool along the second liquid crystal film of the size of cutting wire cutting, the cutting depth can be along the thickness direction of the liquid crystal film cutting liquid crystal film to make the first size liquid crystal film is cut into several separate second size liquid crystal film; Half cutting process: using the cutting tools all along the secant of the size liquid crystal film cutting, first of all the position of the secant from the edge of the second size liquid crystal film to within 0. 1 ~ 10 mm, deep into liquid crystal film cutting tools for cutting depth of the distance between the first conductive layer and the second conductive layer, so that in the second the size of the liquid crystal film is formed on a third the size of the area and is located in the third the size of the LCD liquid crystal membrane membrane area periphery cutout area; Remove leftover material: the second size LCD membrane cutout area above the cutting depth of materials from the second size of liquid membrane separation, the third the size of liquid crystal film material in the area of the complete reserves in the second on the size of the liquid crystal film.
further, all secant described in the first and the second cutting line spacing between cutting graphics, respectively, including several of the closing of the graphics.
using the laser cutting machine laser equipment factory HZZ - endeavour V3000( 我。 LASER3000) Perfect to help you solve the problem of bistable liquid crystal film cutting.
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